Thus, to use the ModICE it will most likely need a hardware fork. There are few things to consider while at it too. The dual heatsink enclosure can support 12 FETs (or TO220's to be exact) and the case isn't ventilated, decision is needed what to keep and what not to. The casing has very high protection rating; from proofing against water jet to full and permanent submersion. Data lines should therefore be routed through the main connector so this benefit would not be compromised. On the plus side, the data terminals (CAN, USB, SD card bay)can be installed to a spot much easier to reach than they would be on the actual box. The biggest downside seems to be the lack of prototyping and modifying room inside the case, but if, and I hope when, CAN and whatever serial protocols are implemented, there will be lots of possibilities for external expansion.
It might be a good idea to wait a bit and see into which form the FreeEMS standard settles first though, and stick to more generally usable PCB's until that time though.
I used this datasheet in making the PCB base for the unit:
http://www.cinch.com/pdfs/1219441260-58 ... _rev_C.pdf
The module is like this:
It's simply the two connector banks displayed as A and B.
The footprint is like this:
The blue lines are for component height zones; the details are in the PDF. Component and trace exclusion zones are marked on top and bottom silk layers. There are slots for TO220 springs. There were no pin order preferences for the connectors, so I used a simple running numbering starting from top left and running down then right. No component should be closer than 2.54mm from any PCB edge. Maximum component height on the bottom layer is 2.54mm.
The libraries should not require any more work than extracting them to the work directory, open both EESchem and PCBNew and add the cinch.* -libraries. The schematics module has the footprint filter set so netlist association should be a bit easier too.
EDIT: old attachment deleted.
