I didn't mean an official one. I meant home brew style, much like my digital input stuff that I have above the CPU. Just noting the large blank space there. And, with a solid ground plane under it, I doubt there'd be much noise.DeuceEFI wrote:Wouldn't this be a noisy environment when the injectors are firing? Not sure if this would be a good idea for a prototyping area.Fred wrote:(10:49:26) Fred: just noticed BIG space on under side of dpaks perfect for more perf board circuits
I meant footprints, btw, pads seem mostly OK as is.I do need to re-visit the size of all the solder pads, so there should be some space saving changes as these are re-sized.Fred wrote:(10:55:58) Fred: DeuceEFI: the diode pads for the led blockers are way too big for the std parts, some space to save there?
Probably a worse idea than not doing it due to lack of heat possible.I will give this some additional consideration.Fred wrote:Could put vias on all of the dpak pads and cut around the vias on the other side. Not really necessary though. They won't get hot unless shorted.
OK.The SMD XOR is smaller that the DIP XOR chip, but we are using a chip with the largest number of gates (4 gates) that I can find.
Why? OK, I know why. But what I mean is, how about some pads so that they can be used for buffered inputs/outputs?Note that two of the unused gates on the chip have their inputs tied to +5v.
Is this pushed? Didn't notice it fly by. Curious as to what you've done.I have already moved the components for the MAP input around so that the diodes, capacitors and the resistor are not under the on-board sensor.
Fred.